Chip stories - Page 5

Wi-Fi, Bluetooth, and cellular IoT are making up nearly 80% of the market, according to the latest State of IoT Spring 2023 report.

Recorded Future identifies five high-risk vulnerabilities, including four zero-days, affecting Microsoft, Adobe, Fortinet, and Samsung.

Open RAN testing lab consultancy supports mobile operators and network equipment manufacturers in validating Open RAN interoperability and performance.

The SmartSat NSW Node and Aurora Space Startups Cluster are funding projects representing a significant portion of the Waratah Seed mission budget.

Some important considerations are rising electricity prices, introduction of EV taxation, unreliable global charging infrastructure, and poor service quality.

The Oppo Find N2 Flip phone offers four years of ColorOS updates and five years of security updates to provide the most extended support in Android.

Equinix’s distributed bare metal as a service is now available in Osaka and Melbourne, along with ones in Hong Kong, Seoul, Singapore, Sydney and Tokyo.

Equinix Metal in Sydney and Melbourne strengthens interconnectivity between both metropolitan hubs to meet diversified digital needs.

Adoption is reaching its peak due to the new computing architectures' ability to fulfil the needs for data processing, transfer rates, and energy usage.

Fortinet unveils FortiSP5, a breakthrough in ASIC technology, offering enhanced security and cost savings for distributed networks.

Samsung unveils its new flagship mobile devices, the S23, S23+, and S23 Ultra, boasting upgraded camera systems and powerful features.

These technologies include smarter sensors, more power-efficient sensors, soft and virtual sensors, sensor fusion, and biosensors.

Apple has announced the release of its new generation MacBook Pro laptops, containing its more powerful updated chipsets, the M2 Pro & M2 Max.

Apple unveils new Mac mini systems with M2 & M2 Pro chips offering faster performance, higher memory bandwidth, and improved connectivity options.

The global near-field communication market was US$17,875 million in 2020 and will be US$46,781 million by 2027, registering a CAGR of 14.8% from 2021 to 2027.

AVIVA Links unveils first Automotive Serdes Alliance-based chipset, delivering over 64 Gigabits per second for in-vehicle networks.

The researchers find that the wireless communications market has grown significantly, due to a number of factors, with APAC a top contributor.

The global automotive semiconductor market is poised to increase at a CAGR of 7% during the assessment period from 2020-2030.

Strategic investments in the telecom sector help governments harness the potential to create employment and drive the economic growth of countries.

To remain profitable, leading cloud players will need to pivot their investments to analytics, AI/ML, and other differentiated premium services.